BE Semiconductor Industries (OTCMKTS:BESIY) Plans Annual Dividend of $1.73

BE Semiconductor Industries (OTCMKTS:BESIY) declared an annual dividend on Thursday, April 15th, Zacks reports. Shareholders of record on Wednesday, May 5th will be given a dividend of 1.729 per share by the technology company on Monday, May 10th. This represents a yield of 1.89%. The ex-dividend date of this dividend is Tuesday, May 4th.

OTCMKTS:BESIY opened at $80.50 on Friday. The company has a debt-to-equity ratio of 0.95, a current ratio of 5.63 and a quick ratio of 5.10. The firm has a market cap of $6.45 billion, a price-to-earnings ratio of 46.26 and a beta of 1.60. The company has a 50 day moving average price of $84.59 and a 200-day moving average price of $65.26. BE Semiconductor Industries has a 1-year low of $36.40 and a 1-year high of $93.65.

BE Semiconductor Industries (OTCMKTS:BESIY) last posted its earnings results on Friday, February 19th. The technology company reported $0.66 earnings per share for the quarter. The firm had revenue of $130.81 million during the quarter. BE Semiconductor Industries had a net margin of 29.19% and a return on equity of 41.83%.

Several equities analysts have recently weighed in on the stock. Berenberg Bank reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a report on Friday, January 8th. Deutsche Bank Aktiengesellschaft reaffirmed a “hold” rating on shares of BE Semiconductor Industries in a report on Wednesday, April 14th.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chips, multi chips, multi modules, flip chips, TCBs, FOWLP and hybrid die bonding systems, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems.

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