StockNews.com Downgrades ASE Technology (NYSE:ASX) to Hold

StockNews.com cut shares of ASE Technology (NYSE:ASXGet Rating) from a buy rating to a hold rating in a research note issued to investors on Tuesday morning.

ASE Technology Trading Up 0.6 %

NYSE:ASX opened at $6.49 on Tuesday. ASE Technology has a 1-year low of $4.45 and a 1-year high of $8.15. The business’s 50-day moving average price is $5.43 and its two-hundred day moving average price is $5.85. The company has a current ratio of 1.22, a quick ratio of 0.85 and a debt-to-equity ratio of 0.42. The firm has a market capitalization of $14.15 billion, a price-to-earnings ratio of 5.32, a PEG ratio of 0.33 and a beta of 1.11.

Hedge Funds Weigh In On ASE Technology

Hedge funds have recently added to or reduced their stakes in the stock. CWM LLC lifted its stake in ASE Technology by 116.8% in the second quarter. CWM LLC now owns 5,007 shares of the semiconductor company’s stock valued at $26,000 after buying an additional 2,697 shares during the period. Penserra Capital Management LLC acquired a new position in ASE Technology in the third quarter valued at about $34,000. EverSource Wealth Advisors LLC raised its position in shares of ASE Technology by 299.4% during the first quarter. EverSource Wealth Advisors LLC now owns 4,992 shares of the semiconductor company’s stock worth $35,000 after purchasing an additional 3,742 shares during the period. Ballentine Partners LLC acquired a new stake in shares of ASE Technology during the third quarter worth about $51,000. Finally, Flow Traders U.S. LLC acquired a new stake in shares of ASE Technology during the third quarter worth about $52,000. Institutional investors and hedge funds own 6.57% of the company’s stock.

About ASE Technology

(Get Rating)

ASE Technology Holding Co, Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions.

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