Oxford Instruments plc (OXIG) to Issue Dividend of GBX 5.10 on January 10th

Oxford Instruments plc (LON:OXIG) declared a dividend on Tuesday, November 12th,Upcoming Dividends.Co.Uk reports. Shareholders of record on Thursday, November 28th will be given a dividend of GBX 5.10 ($0.07) per share on Friday, January 10th. This represents a dividend yield of 0.24%. The ex-dividend date is Thursday, November 28th. The official announcement can be accessed at this link.

Oxford Instruments Stock Performance

Shares of Oxford Instruments stock opened at GBX 2,075 ($26.70) on Thursday. The business has a 50-day simple moving average of GBX 2,094.33 and a 200-day simple moving average of GBX 2,306.46. The company has a debt-to-equity ratio of 12.96, a quick ratio of 1.11 and a current ratio of 1.64. Oxford Instruments has a one year low of GBX 1,932 ($24.86) and a one year high of GBX 2,765 ($35.58). The company has a market cap of £1.20 billion, a PE ratio of 2,424.42, a P/E/G ratio of -3.56 and a beta of 0.96.

Analyst Ratings Changes

A number of research firms have recently commented on OXIG. Shore Capital reiterated a “buy” rating on shares of Oxford Instruments in a research report on Wednesday, October 16th. Berenberg Bank cut their price target on Oxford Instruments from GBX 2,925 ($37.64) to GBX 2,830 ($36.42) and set a “buy” rating on the stock in a research report on Tuesday.

About Oxford Instruments

Oxford Instruments plc provide scientific technology products and services for academic and commercial organizations worldwide. It operates through three segments: Materials & Characterisation, Research & Discovery, and Service & Healthcare. The company offers atomic force, electron, and Raman microscopy; deposition tools comprising plasma enhanced chemical vapour deposition, chemical vapour deposition, inductively coupled plasma chemical vapour deposition, atomic layer deposition, and ion beam deposition systems; and etch tools, including inductively coupled plasma etching, reactive ion etching, deep silicon etching, atomic layer etching, and ion beam etching systems.